1. Used to locate and relocate mobile phone PCB BGA parts.
2. Reombard BGA quickly and easily without any damage, providing a solution for iPhone 11 Pro / Pro Max BGA repositioning and repair.
3. Strong magnetic adsorption, simple operation.
4. Stencils will not deform under high temperature.
5. Fast and convenient solderingTags: Repair Tools, BGA Stencils.